Shanghai Huitian New Material Co., Ltd
Shanghai Huitian New Material Co., Ltd Bond today and future ,with our technology!
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| Item | Unit | Typical Value |
| Item No. | 0112G | |
| Physical Form | paste | |
| Color | white | |
| Main Component | polysiloxane | |
| Density | g/cm3 | 2.65 |
| Penetration Degree | 1/10cm | 300 |
| Volatility(200℃,24h) | % | 0.2 |
| Volume Resistivity | Ω*cm | 1.0×1015 |
| Dielectric Strength | KV/mm | 24 |
| Breakdown Voltage | KV/mm | 20 |
| Surface Resistance | Ω | 2.5×1014 |
| 0.1mm Thermal Resistance | m2K/W | 0.00014 |
| Work Temperature | ℃ | -40~200 |
| Heat Conductivity Coefficient | W/(m·K) | ≥1.35 |
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
Packing:
2kg/bucket, 6buckets/carton
Storage:
