Product Description
5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.
Product Applications
The 5280CA9/5280CB9 Potting Compound is widely used in various electronic applications, including:
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Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
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LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
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Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
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Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
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General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.
Key Product Features
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High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m·K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
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UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
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Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
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Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
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RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive, making it suitable for use in a wide range of applications.
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Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.
Technical Parameters
| Parameter | Value |
| Physical Properties Before Curing (25±2℃, 60%±5%RH) |
| Appearance (A) | Gray flow |
| Appearance (B) | White flow |
| Viscosity (A) | 2,000~3,500 mPa·s |
| Viscosity (B) | 2,000~3,500 mPa·s |
| Curing Properties (A:B=1:1) |
| Operating Time (25℃) | 60~240 min |
| Curing Time (85℃) | ≤30 min |
| Physical Properties After Curing (25±2℃, 60±5%RH, A:B=1:1) |
| Density | 1.70~1.9 g/cm³ |
| Hardness | 10~30 Shore A |
| Shear Strength (PCB) | 0.3-0.8 MPa |
| Thermal Conductivity | ≥0.6 W/m·K |
| Dielectric Strength | ≥14 KV/mm |
| Volume Resistivity | ≥1.0×10¹² Ω·cm |
Directions for Use
Preparation
Mixing
Defoaming
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Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
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Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.
Potting
Curing
Packaging & Storage Conditions
Packaging:
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5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
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Storage: Store at room temperature in a cool and dry place. The shelf life is 6 months.
