Shanghai Huitian New Material Co., Ltd

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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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Shanghai Huitian New Material Co., Ltd
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City:shanghai
Province/State:shanghai
Contact Person:MrSimon Dou
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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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Brand Name :HUITIAN
Model Number :0117
Certification :SGS
Place of Origin :China
MOQ :100KG
Price :Negotiation
Payment Terms :T/T, L/C
Supply Ability :5000kg/Month
Delivery Time :5-8 days
Packaging Details :1kg/barrel
Physical Form :Paste
Color :Gray
Viscosity, ASTM D2196 :180,000 mPa·s
Density, ASTM D792 :3.3±0.2
Minimum interface thickness :14.9 μm
Thermal Conductivity, ASTM D5470 :4.0±10% W/ m·K
Work Temperature :-50~150 ℃
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View Product Description

0117 TDS-EN.pdf

Product Description

  • Silicone thermally conductive compound
  • Gray paste
  • Non-curing type

Product Features

  • Thermal conductivity: 4.0 W/ m·K
  • It contains metal powder to enhance thermal conductivity and non-insulating
  • Very small interface thickness and very low interface thermal resistance
  • Proper viscosity and proper thixotropy for fast large-area screen printing or hand-painting
  • No residual stress after gluing effectively protects precision electronic components from damage

Typical applications

  • Widely used as a heat transfer medium for electronic components, such as CPU, IGBT, automotive electronics, LED lighting, large storage devices, smartphone modules, consumer electronics, etc.

Directions for use

  • It is recommended to pre-stir the product which has been placed for a long time before use.
  • Test confirm with a sample before applying the product to the material.
  • Before use, clean the surface to be applied and remove oil and dirt.
  • The sizing surface should be even and consistent, as long as a thin layer is applied.
  • To avoid being polluted by dust and other impurities, the product should not be exposed to the air for a long time.

Technical parameters

Reference standard Item Unit Value
ASTM D792 Density g/cm3 3.3±0.2
ASTM D2196 Viscosity mPa·s 180,000
Minimum interface thickness μm 14.9
ASTM D5470 Thermal resistance @12psi ℃∙cm²/W 0.11
ASTM D5470 Thermal resistance @40psi ℃∙cm²/W 0.07
ASTM D5470 Thermal conductivity W/ m·K 4.0±10%
ISO22007 Thermal conductivity W/ m·K 4.7±10%
Long-term operating temperature -50~150

Cautions

Keep away from children for storage.

On the premise of filling the gap, the thinner the coating, the better.

If the skin is accidentally exposed to the product, wipe clean and rinse with water.

If the eyes are accidentally exposed to the product, rinse immediately with plenty of water and seek medical examination.

Please consult the MSDS of the product for details.

Storage

Store at 8-28°C in a cool and dry place.

Shelf life is 12 months.

Packing specification

Order code: Shanghai, 011711;

Net weight 1000±5g

0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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