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Shanghai Huitian New Material Co., Ltd

Shanghai Huitian New Material Co., Ltd Bond today and future ,with our technology!

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10 Years
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Home / Products / Thermal Interface Materials / 0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT /

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PV Backsheet Material

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PV Sealant

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Potting Compound

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Industrial Adhesive

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UV Bonding Adhesive

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Automotive Adhesive

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Water Resistance Glue

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Bond And Seal Adhesive

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Packaging Adhesive

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Construction Adhesive

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Electronic Potting Compound

 [27]

Conformal Coating

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Thermal Interface Materials

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UV Light Cure Adhesive

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Battery Cell Adhesive

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Battery Potting And Encapsulation

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Engineering Adhesives

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Railway Industry Adhesive

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SMD LED PCB

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Glue For Car Parts

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Automotive Assembly Adhesive

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Automotive Aftermarket Products

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Window Door Sealant

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Curtain Wall Sealant

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Solvent Based Adhesives

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Solventless Adhesives

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Shanghai Huitian New Material Co., Ltd
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City:shanghai
Province/State:shanghai
Contact Person:MrSimon Dou
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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
  • 0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
  • 0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
Products Detailed
0117 TDS-EN.pdf Product Description Silicone thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m...
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